Copper Plating Brighter for PCB Pattern Plating
Copper Plating Brighter BM-100 is a high-performance DC plating system. Its high deep current and high current application ability make it more suitable for circuit board design with high aspect ratio and buried vias (high-density interconnect).
Performance can also meet the performance requirements of different downstream customers.
Performance can also meet the performance requirements of different downstream customers.
Shenzhen Kewei Industries Limited
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PCB Wet Process Chemicals
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Copper Plating Brighter for PCB Pattern Plating
Copper Plating Brighter for PCB Pattern Plating
Copper Plating Brighter BM-100
1) Product Features
Super strong deep plating ability/high current application, high ductility, low internal stress, uniform coating; DC plating Lightening agent system, low consumption of lightening agent.
Bm-100 can be directly used in traditional electroplating equipment without the need for additional equipment investment. This enables manufacturers to reduce investment costs In addition, it can produce high-quality products.
Features & Advantages
| Features | Advantages |
| High current application capabilit | Can reduce production cycle time and increase production capacity. |
| High current application capabilit |
Suitable for high aspect ratio and buried vias (high density interconnects). The design of the circuit board can ensure that the minimum copper thickness is achieved. |
| Uniform coating | Makes subsequent etch control easier, while reducing The remaining copper consumption reduces costs |
| Excellent performance of electroplated copper layer. | Suitable for multiple high-temperature treatments without copper breakage. |
| Suitable for traditional DC plating | Manufacturers do not need to make additional investment in equipment, reducing investment costs Yu can produce high quality products. |
| Low light consumption | Reduce production operation costs. |
2) Physical Properties
| Characteristic | BM-100 |
| Ductility direct | 8% |
| After aging | 25-30% |
| Pull tension directly | Approx. 420N/mm2 |
| After aging | Approx. 300N/mm2 |
| Thermal shock | 3-5 times without delamination at 288 ℃ |
| Levelling | Excellent |
| Surface | Bright |
| Electrical Conductivity | 55.1Sm/mm2 |
| Hardness | 140-180HV(0.05) |
| Internal Stress | 5 N/mm2 |
