Semi-Bright Pure Tin Additive for PCB Tin-Plating

BM-308 Semi-Bright Pure Tin Additive

1) Product Feature

1. The coating is uniform and detailed, the through-hole is good, and the etching resistance is strong.

2. Easy operation and management, and no fluorine and lead pollution problems.

3. The plating solution is stable, and the operating temperature and current range are large.

4. It can save a lot of tin peeling potion, and the use cost is low.

2) Composition of Bath

3) Open Bath of Plating Solution

1. First add 2/5 cylinder volume of deionized water, then add sulfuric acid, and finally add a sufficient amount of stannous sulfate to stir and dissolve, then locate with pure water;
2. Add 20ml/L SCC-308 additive, and then plate the electrolytic wave plate at 0.5-1.5ASD for 4 hours.
 

Operating conditions

Precautions

1. When the plating solution is contaminated by organics, filter with a carbon core.

2. When the plating solution is contaminated with metal, it is electrolyzed with a small current.

3. Tin salt solution causes turbidity of the plating solution.A small amount of precipitation does not affect the operation.Too much precipitation needs to be coagulated with a flocculant and then removed by filtration.

4) Analytical Method

H₂SO₄ analysis

Take 2ml of the test solution into a 250ml Erlenmeyer flask, add 50ml pure water to shake, add 2-3d methyl orange indicator, and titrate with 1.0mol/L NaOH standard solution until the solution becomes orange yellow as the end point.

Calculation: (standard fluid consumption) H₂SO₄ (ml/L) = 13.3 × (standard fluid consumption) mlNaOH

SnSO₄ analysis

Take 20ml of 20% hydrochloric acid solution into a 250ml Erlenmeyer flask, add 30 ml of pure water, then add 5ml of the test solution to shake, add 2-3d starch indicator, titrate with 0.1mol / LI₂ standard solution until the solution changes End in blue.

Calculation: (standard fluid consumption) SnSO₄(g/L) = 2.145 × (standard fluid consumption) mlI₂