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PCB PISM Ink Photoimageable Solder Mask Ink

Liquid Photoimageable Solder Mask Ink 201 Series
201 this series of inks are two-component screen printing liquid photosensitive solder masks ink, suitable for high-precision printed circuit boards, with high resolution, excellent heat resistance and chemical resistance.

Shenzhen Kewei Industries Limited ꄲ PCB Inks ꄲ PCB PISM Ink Photoimageable Solder Mask Ink

PCB Production Main Materials

PCB PISM Ink Photoimageable Solder Mask Ink

Liquid Photoimageable Solder Mask Ink 201 Series

201 this series of inks are two-component screen printing liquid photosensitive solder masks ink, suitable for high-precision printed circuit boards, with high resolution, excellent heat resistance and chemical resistance.

1. Product Model

Item Name		Color
PISM INK	201GA	Light Green (Yellowish phase)
	201GB	Medium Green(Yellowish phase)
	201GC	Matte Green (Bluish phase)
	201W	White
	201BK	Black
	201R	Red
	201Y	Yellow
	2.201BU	Blue
	201V	Purpose

2. Physical Characteristic

Item	Characteristic	Remarks
Fineness	≤8μm	0~25μm (Scraper fineness meter)
Mixing ratio	Main agent/hardener = 750:250	Weight ratio
Main Ink Viscosity	210±40dPa’s	VT-04E viscometer (25℃)
Nonvolatile component	70-72wt%	After Mixing
Precuring Range	75℃/55mins	Max.
Properly Expose Energy	300~600mj/cm²	Energy on the Ink surface
Storage Time after Mixing	24 hours	≤25℃ dark Place
Storage Life	6 months	≤25℃ dark Place
Exposure energy	600-900mJ /cm²	UV energy
Packaging	main agent: 750g; curing agent: 250g	conventional packaging

Thinner additive amount is about 0~30ml/kg (Please using our special thinner)

3. Pre-curing Range

75℃	30mins	40mins	50mins	60mins
Development	0	0	0	0

Development Condition: 1%Na2CO4 30℃, 40~60secs, 1.8~2.0Kg/cm², “0” means OK

4. Shelf Test (75℃, 25 mins after pre curing)

Time	12 hr	24 hr	36 hr	48 hr
Development	0	0	0	0

Environment: 22℃, 66%RH, “0” means OK

5. Photosensitive Property

Item	Ink Thickness	Exposing Power	Development Time	Exposing Grade
21 Grade Exposing Scale	25μm	300mj/cm²~600mj/cm²	40~60 secs	9~11 Grades

6. Operating Procedures

Procedure	Condition
CCL Surface Treatment	Standard Acid Processing and Brushing
Ink Mixing	Mixing the Main ink and the harder, manual/auto mixing and let it stand for 10 mins
First side printing	36~51T screen mesh, after printing let it stand for 10 mins
Pre-baking	70~75℃ 15~20 mins
Second Side Baking	70~75℃ 25~35 mins
Exposing	300~600mj/cm², 9~11 grade (21 grade scale)
Standing Time	10 mins
Developing	1% Na₂CO₃30℃ 45~55secs, Pressure 1.5~2Kg/cm²
Post-baking	150℃, 60mins

If using Double Side Printing, the pre-baking time should be 25~35 mins.

7. Chemical Resistance

Chemical	Dipping Time	Result
Isopropanol	Room Temp. 20mins	Normal
Methylbenzene	Room Temp. 30mins	Normal
Sulfuric Acid (10%)	Room Temp. 30mins	Normal
Hydrochloric Acid (10%)	Room Temp. 30mins	Normal
Sodium Hydroxide(10%)	Room Temp. 30mins	Normal
1.1.1.Trichloroethane	Room Temp. 30mins	Normal
Environmental Standards	Comply with ROHS directive	SGS Pass

8. Physical Property

Items	Performance	Testing Condition
Coating Hardness	＞6H	IPC-SM-840B 3.5.1.2. (MITSUBISHI PENCIL)
Wear-resisting property	Normal	IPC-SM-840B 3.5.1.1.
Surface adhesion	Normal	IPC-SM-840B 3.5.2. to Gold or Nickel and tin
Machinability	Normal	IPC-SM-840B 3.5.3.Drilling/Punching Testing
Heat Resistance	260℃±5℃ 10secs*3 times	JIS C6481 5.5
Combustibility	UL94 V-0	IPC-SM-840B 3.6.4.

9. Electrical Specification

Items	Performance	Testing Condition
Insulation breakdown voltage	1000V De/mil	IPC-SM-840B 3.8.1.
Volume Resistance	1 x 10¹⁵Ω	ASTM D-257 ASTM D-257
Surface Resistance	1 x 10¹⁵Ω	IPC-SM-840A 3.8.2.
Insulation Resistance	1 x 10¹⁵Ω 1 x 10¹⁵Ω 1 x 10¹⁵Ω	Class 1 35℃ 90% RH 4 Class 2 50℃ 90% RH 7 Class 3 25~65℃ 90% RH 7
Dielectric dissipation factor	0.02	JIS C6481 1MHz

10. Note

1) Operating environment requirements: printing room and exposure room, the temperature must be 22 ℃ ± 2 ℃, temperature 55-65% in a dust-free room, in addition, if used directly or indirectly under white light or sunlight, it will cause ink Photopolymerization reaction, so please work without UV light.

2) When the ink temperature returns to room temperature, then can be opened and used, mixed with the specified amount of hardener(Curing Agent), fully stirred and stand for use.

3) The thickness of the ink is preferably 20-25um. If the film thickness is thin, it is easy to reduce the solder heat resistance, chemical resistance and the need for gold plating ability. If the coating film is too thick, the exposure not enough to complete the exposing, which is easy to occur Excessive side erosion and reduced dryness.

4) Printing can not directly paste the adhesive cloth, it is easy to have residual glue and cause dents on the board surface.

5) When printing, pay attention to avoid printing ink into the hole. If the ink is printed into the hole, the development time must be prolonged, otherwise, it will make the hole inside development unclean.

6) The pre-bake conditions and the allowable range of pre-bake will vary with the type of oven and the number-quantity of PCB in the oven. Therefore, it is necessary to perform confirmation experiments before setting appropriate conditions.

7) The exposure energy will vary depending on the PCB material and the thickness of the coating film, so experiments are required to confirm the minimum residual width of the ink, surface gloss and backside sensitivity, and then set appropriate conditions.

8) Water green/ White/ black color, the exposure energy should be increased, otherwise it will easily cause cracks after development and after baking, and will be broken.

9) When the developing temperature and time are insufficient, the developing will be unclean, and the phenomenon of excessive side erosion will easily occur when the developing temperature and time are exceeded, and the surface of the ink will be attacked and affect the ink features. Please strictly control the concentration of the developing wave/ temperature/ nozzy pressure/time, so it is necessary to perform confirmation experiments before setting appropriate conditions.

10) When the post-baking temperature is insufficient in time, the tin spraying will cause paint peeling, and excessively will reduce the gold plating resistance. Therefore, after confirming the experiment, set the appropriate conditions for tin spraying and gold plating.

11) After the hole plugging, it must be baked in sections: 80℃×30min, 100℃×30min, 150℃×50min.

12) If you need to print legend ink, please pay attention to setting the baking time after solder mask suitable for legend ink, otherwise insufficient hardening will reduce the characteristics of the ink coating.

13) When the PCB is electrolessly gold-plated, it is best to first gold plating and then print the legend ink, otherwise the gold-plating resistance will be reduced when the hardening is excessive.

PCB Circuti Ink(Etching Resist Ink), Marking Ink, Peelable Solder Mask Ink etc......

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Shenzhen Kewei Industries Limited has nearly ten years of production and sales experience in PCB auxiliary materials, and has formed eight series of more than 200 varieties, including Artwork Film, PCB Tools, Drill Backup board/ Entry Sheet, PCB Ink, Wet Process Chemical, Dry Film, Machine Spares and Other production consumables. We have full and complete production materials for Rigid PCB Factory/ Multi-layer Factory/ FPCB factory. Also we provide Machine Spindle Services, PCB factory setup / upgrade solution by our experienced team. We aim to provide "one-stop" services to all the PCB factory.

Shenzhen Kewei Industries Limited
Kewei Industries (HK) Limited
Email: sales5@sz-kewei.com; support@sz-kewei.com
Tel/Fax: 0086-769-22211186
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