Cover Film(CVL) Coverlay for for FPC Pressing Process
FCCL Flexible Copper Clad Laminate for FPC Production
Usage
- -Cover and protect the FPC circuit and enhance the flexibility of FPC
- -Protect the circuit from temperature, humidity, pollution or corrosive substances
- -Cover for subsequent surface treatment of FPC
Features
- -Suitable for both traditional and fast pressing methods
- -Good long-term heat resistance and high peel strength
- -Good glue overflow control
- -Superior flexibility, suitable for high bending soft board
- -Good storage stability
- -Meet the requirements of the RoHS directive
Product Model
|
PN |
PI Thickness |
Adhesive layer thickness |
Width |
|
|
CVL |
KIH1215 |
12.5 μm |
15 μm |
250 mm |
|
KH1225 |
12.5 μm |
25 μm |
250 mm |
|
|
KIH2525 |
25 μm |
25 μm |
250 mm |
|
Technical Parameter
|
Characteristic |
Unit |
Standard |
Testing Method |
|
|
Product Structure |
PI |
μm |
Median±2.0 |
micrometer |
|
AD |
Median±2.0 |
|||
|
Appearance |
- |
Smooth surface, no obvious wrinkles, burrs, etc. |
visual observation |
|
|
Color |
- |
yellow, white, black etc. |
Sample card visual inspection |
|
|
Peel Strength |
Kgf/cm |
≥0.7 |
IPC-TM650 2.4.9 |
|
|
Resin Flow |
mm |
0.08~0.15 |
IPC-TM-650 3.17.1 |
|
|
Flame Resistance |
- |
UI194 V-0 |
UL94-V0 |
|
|
Insulation Resistance |
M.D |
1.0*10 |
JIS-C647 1.7.1 |
|
|
Dimensional Stability |
MD |
% |
＜0.15 |
IPC-TM-650 2.2.4 |
|
TD |
% |
|||
|
Dip Soldering Resistance |
% |
300℃/10sec |
IPC-TM650 2.4.13 |
|
|
Halogen Content |
ppm |
Br≤900 CI≤900 Br+CI≤1500 |
En14582 |
|
More details, please kindly contact:
sales5@sz-kewei.com
0086-13537348123
