FPC TPX Release Film
Used for FPC fast pressing, large gold surface, as well as steel sheet reinforcement with higher tin top requirements, and pressing of soft gold surface; suitable for FPC pressing process with higher requirements for glue resistance and filling
FPC TPX Release Film
TPX release film is a high-performance high temperature resistant resin barrier release film, which is used in the lamination process of circuit boards. After special process design, it can be used for multiple lamination processes of buried holes and blind via holes after resin overflow. It has good glue blocking and hole plugging effect
Features
- -No silicon on the surface, no risk of transferring contamination
- -Good resistance to glue, can meet the needs of different CVL pressing
- -Better product stability after pressing
- -Can meet the pressing requirements of browning surface
Product Model
|
Name |
Thickness |
Appearance |
Advantages |
|
T4120D |
120μm |
Matte |
Smooth surface |
|
T4120R |
120μm |
Smooth surface |
|
|
T4120Z |
120μm |
Double-matte surface |
More details, please kindly contact:
sales5@sz-kewei.com
0086-13537348123
